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Developing Process of a Silicon Semiconductor

Silicon is one of the next abundances of an element found in nature after oxygen. It covers up to 27% of the earth crust. This grey colored brittle, the tetravalent chemical element is contained of quartz, flint, agate and common soil of finding on a beach. Cement, brick, glass and other materials are mainly made of silicon component.

They are used to built semiconductors and microchips. Paradoxically, silicon by itself does not produce electricity well. Even though, it can take dopants for controlling resistivity in accordance with the specification. In markets, silicon prices are affordable as they hold various properties. Before preparing semiconductor, silicon is turned into the wafer. And the process begins with the development of silicon ingot.


Development of ingot for wafers

 A single silicon crystal consists of many atoms that are arranged in a three-dimensional periodic pattern. And this atom extends throughout the substances varying service. By different orientations of numerous small single crystals, a poly-silicon crystal is produced. The development of ingot depends on various factors of the silicon including the size, quality, and its specification.

Mostly the growth of single silicon wafer happens via Czochralski method. The chunks placed in quartz crucible with specific group III and group IV elements in small quantities are called as dopants. They provide a suitable amount of electrical properties for ingot growth. Boron, phosphorus, arsenic, and antimony are some types of common dopants used. Reliant on the types of dopants, ingot takes either N or P form.

Slicing of formed ingots

After the complete development of ingot, they undergo various inspections to proc4eed further the process of slicing. As silicon’s possess hardness property, a diamond edge saw carefully slices the wafers to attain much thicker silicon wafer than the expected one. eventually, diamond edge saw help preventing further damages to the wafer, along with thickness variations and other qualities.

Lapping is an effective process carried after the slicing of wafers. This method removes saw marks and other defects from the front and backside. After thorough cleaning, wafers are used as a semiconductor material.
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